The global launch date for the iPhone 3G is getting closer and closer, and today we have some insight in to what could be a component supplier breakdown for the iPhone 3G. Chinese-language tech-rag Commercial Times is reporting that the iPhone 3G will be integrated by Foxconn (Hon Hai), not Quanta, as earlier reports had indicated. And, [...]

And they just keep rolling in like unstoppable forces of nature. The iPhone 3G (or 3G iPhone / iPhone 2, call it what you want) rumors are starting to get dizzyingly out of hand. Late last night we saw some purported marketing material leaked out for all 3G iPhone hopefuls to drool over, but it [...]

A few grains of salt would be prudent in this case, but with the 3G iPhone launch imminent, any and all iPhone-related rumors are at least worth considering. Especially when such speculation hints that Apple might have to delay the launch of the high-anticipated next-generation iPhone. According to UBS Investment Research analyst Nicolas Gaudois, Infineon has [...]

Following on Infineon's recent announcement that their CEO will be stepping down at the end of this month, Samsung has announcement that they've tapped Infineon to supply the mobile chips for Samsung handsets. In doing so, Samsung will no longer be sourcing wireless components from Qualcomm. The South Korean company has purportedly chosen Infineon as their [...]

Following on repeated quarters of red-ink stained financial reports tied to its Qimonda memory unit, Infineon has announced that its CEO will be stepping down effective June 1. Infineon chief Wolfgang Ziebart will reportedly be leaving the company before his contract expires in September 2009, and will be succeeded by Peter Bauer. There is reportedly some [...]

Apple's preparing to launch their 3G iPhone in the US with a cut-back in current iPhone stock. And, following on reports that Apple's placed a 10 million unit-strong order for iPhones (presumably 3G versions) with Taiwan-based Hon Hai (Foxconn), we're hearing that the 3G iPhone will indeed launch at Apple's Worldwide Developer Conference in June. The [...]

Following on previous rumors that the next-generation 3G iPhone will be powered by a 3G cellular communications chip (cellular baseband) from Infineon, the new iPhone SDK beta reveals that the 3G chip powering the 3G iPhone may indeed be sourced from Infineon. The makers of ZiPhone have found, after drudging through the new iPhone SDK [...]

The SIM (Subscriber Identity Module) card is almost as ubiquitous is today’s mobilized society as the mobile phone itself. With GSM networks covering the world, it’s no wonder that the SIM card is as widely used as it is. Well, Infineon has announced that it will be working with chip-making giant Intel to develop high-density (HD) SIM cards boasting 32-bit security and 4MB - 64MB of on-board storage for “data-intensive mobile applications, services and over-the-air downloads.” Infineon will be developing the 32-bit security micro-controller, while Intel will be bringing their “leading-edge flash memory technologies, capabilities and manufacturing” prowess to the table. These types of HD SIM cards should make up 8-10% of the total SIM card market in 2010, so Infineon’s joint venture might just pay off in a couple years. We’re expecting to see samples of the first HD SIM cards in Q2 of 2008, with mass production slated for the first half of 2009. [Via: EE Times ] ---Related Articles at IntoMobile:Samsung D880 DuoS can take two SIM cardsChinese phone with 3 SIM card slotsMuseums join forces for mobile contentInfineon lands Nokia deal for entry-level phonesNokia to sell WiMax phones in early 2008